Etching
Etcher - Inductively Coupled Plasma Reactive Ion (ICP-RIE) - Trion Technology Oracle III
The Trion Technology Oracle III dry plasma etcher (ICP/RIE) is designed for semiconductor and microelectronic devices or substrates.
Features
• Two process chambers each with a variable valved turbo pump
• Central Vacuum Transport (CVT) load lock for fast processing
• Manual load-lock allows manual loading of a single wafer
• Touch screen operator interface
Location
Electrical Engineering Cleanroom
Davis Hall, Suite 114
University at Buffalo North Campus
Buffalo, NY 14260
Fees
- Internal Academic: $25
- External Academic: $25
- Industry: $100
Etcher - Inductively Coupled Plasma Reactive Ion (ICP-RIE) - Trion Technology Oracle III
For general inquiries, contact:
Donald J. Goralski
Director, Shared Instrumentation Laboratories
(716) 645-5151
For technical inquiries, contact:
Jeff Salzmann
Assistant Professor of Research, Cleanroom Manager
(716) 645-2584