Cleanroom Equipment

The Ultratech / Cambridge Nanotech Savannah S100 Atomic Layer Deposition system enables atomic layer thin metal/oxide film deposition on Ultra High Aspect Ratio substrates. This precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than 2000:1. High quality and very controllable deposition of thin films is possible by this technique.

The Kurt J. Lesker AXXIS Electron-Beam Evaporator with Glancing Angle Deposition (GLAD) enables e-beam deposition of thin films of metals for contact layers on microelectronic devices.

The Kurt J. Lesker Company PRO Line PVD 75 is the next generation thin film deposition system based on the workhorse PVD 75 platform. 

The Trion Technology Oracle III  dry plasma etcher (ICP/RIE) is designed for semiconductor and microelectronic devices or substrates.

The Trion Phantom III dry etcher is designed to supply state-of-the-art plasma etch capability for single wafers, dies or parts using fluorine and oxygen based chemistries. It features both RIE and ICP RF sources.

The Film Sense FS-1 Multi-Wavelength Ellipsometer provides fast and reliable thin film measurements using long-life LEDs and a no-moving-parts ellipsometric detector. The film thickness of most transparent thin films from 0 – 1000 nm can be determined with by a simple 1 second measurement.  Optical constants, n & k, and other film properties can also be measured for many samples.

The JEOL JSM-6500F is a Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment, and Nanometer Pattern Generation Systems (NPGS). It offers high resolution images of very small inorganic and organic surface structures. The NPGS attachment enables lithography applications for semiconductor processing. This system is routinely used to create structures with features down to 50 nm. Higher resolution is possible with sufficient process optimization.

The Carl Zeiss AURIGA CrossBeam Focused Ion Beam Electron Microscope is a state-of-the-art advanced scanning electron microscope integrated with high-resolution focused ion beam milling that enables photographic, chemical, and structural analysis of many inorganic and organic samples as well as nanoscale patterning via FIB etching or FIB-driven deposition of metals and insulators from gas-phase precursors. The system also includes TEM lift-out, Oxford EDS system, and Avizo imaging interface/software for 3D reconstruction.

The Jandel CYL-RM3000 Four Point Probe System is used to measure the sheet resistance of shallow layers (as a result of epitaxy, ion-implant, diffusion or sputtering) and the bulk resistivity of bulk wafers. It is capable of sourcing 10 nA up to 100 mA, and 0 to 1000 mV. Our probe head has 4 tips with a spacing of 1 mm apart from each other. Each tip has a radius of 40 microns and it is preset to a pressure of 60 grams of force that will be exerted on your sample. The maximum pressure is 150 grams. The unit is capable of producing 10 nA up to 100 mA with a voltage of 0 to 1000 mV.

Two stereoscopes available, suitable for a very wide range of applications, from routine laboratory work to educational and research investigations.

Stylus profilers are used to measure surface metrology variations on flat substrates. This profilometer features an automated stage with step height, surface roughness, and film stress measurement capabilities.

The JEOL JSM-6500F is a Field Emission Scanning Electron Microscope (FESEM) w/Electron Beam Lithography attachment, and Nanometer Pattern Generation Systems (NPGS). It offers high resolution images of very small inorganic and organic surface structures. The NPGS attachment enables lithography applications for semiconductor processing. This system is routinely used to create structures with features down to 50 nm. Higher resolution is possible with sufficient process optimization.

The Carl Zeiss AURIGA CrossBeam Focused Ion Beam Electron Microscope is a state-of-the-art advanced scanning electron microscope integrated with high-resolution focused ion beam milling that enables photographic, chemical, and structural analysis of many inorganic and organic samples as well as nanoscale patterning via FIB etching or FIB-driven deposition of metals and insulators from gas-phase precursors. The system also includes TEM lift-out, Oxford EDS system, and Avizo imaging interface/software for 3D reconstruction.

Two stereoscopes available, suitable for a very wide range of applications, from routine laboratory work to educational and research investigations.

The Elionix ELS-G100 electron beam lithography system produces a highly stable beam with a diameter as small 1.8nm, using acceleration voltages of up to 100kV and high beam currents.

The Jandel CYL-RM3000 Four Point Probe System is used to measure the sheet resistance of shallow layers (as a result of epitaxy, ion-implant, diffusion or sputtering) and the bulk resistivity of bulk wafers. It is capable of sourcing 10 nA up to 100 mA, and 0 to 1000 mV. Our probe head has 4 tips with a spacing of 1 mm apart from each other. Each tip has a radius of 40 microns and it is preset to a pressure of 60 grams of force that will be exerted on your sample. The maximum pressure is 150 grams. The unit is capable of producing 10 nA up to 100 mA with a voltage of 0 to 1000 mV.

The UVOCS T10x10/OES Ultraviolet Ozone Cleaning System provides a simple, inexpensive and fast method of obtaining ultra-clean surfaces free of organic contaminants.  This process is ideal when thin film deposition with excellent adhesion to the surface is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the surface has been cleaned by conventional techniques.

Fume hoods available for sample preparation with solvents and acids.

SPI-Module™ Sputter Coater System for precious metals (gold) enables super-fast deposition of thin films of the consistent, fine-grained quality needed for your SEM samples. The unit coats up to 200A of gold in 20 seconds.

The UVOCS T10x10/OES Ultraviolet Ozone Cleaning System provides a simple, inexpensive and fast method of obtaining ultra-clean surfaces free of organic contaminants.  This process is ideal when thin film deposition with excellent adhesion to the surface is required.  Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the surface has been cleaned by conventional techniques.

The Film Sense FS-1 Multi-Wavelength Ellipsometer provides fast and reliable thin film measurements using long-life LEDs and a no-moving-parts ellipsometric detector. The film thickness of most transparent thin films from 0 – 1000 nm can be determined with by a simple 1 second measurement.  Optical constants, n & k, and other film properties can also be measured for many samples.

The Thermo Electron Corporation’s Lindberg/Blue M™ Tube Furnace is a high-temperature air or inert atmosphere 3-zone furnace.  Can be used for diffusing or annealing samples.

The Ulvac Technology MILA 3000 Rapid Thermal Annealing (RTA) vacuum furnace is a programmable tabletop furnace for high temperature materials testing and analysis. It can heat samples to 1200°C in less than 24 seconds using an infrared gold image furnace with a programmable digital temperature controller, a quartz glass chamber and a gas controller.